Almec’s surface mount (SMT) assembly service features the very latest in Auto Placement Machines. We are able to place component packages including fine pitch, BGA's, µBGA's, chip scale BGA’s, CSP's, flip chips and sizes down to 01005. Our equipment is able to place complex surface mount component packages, such as QFP's as large as 50mm. we use intelligent/fast changeover feeders that can be re-loaded without stopping assembly. The machine knows the value and location of each component and exactly how many components remain on each reel.
To complement the efficiency of the placement equipment, Almec uses high performance forced convection reflow oven technology capable of providing the high temperatures required for lead-free surface mount soldering. Our production facility continues to offer leaded surface mount assembly for those applications that require it.
Our production area is divided into unleaded and leaded assemblies, to offer full RoHS compliance. All equipment is clearly colour coded (green for lead free/ red for leaded components).