Our X-Ray inspection technology is operated by trained and knowledgeable test technicians who can interpret the images produced. X-Ray technology can be used to check components and assemblies for faults that may otherwise require a destructive test. There are many possibilities with X-Ray inspection ; some of which are listed below.
• Continuity & Solder coverage on devices such as BGA’s and µBGAs, which would be impossible to check visually
• Examination of parts – this can provide an additional safeguard against counterfeit components
• Internal examination of solder joints – this can be used to demonstrate that lead-free contacts are free of voids and internal cracking
• Checking internal tracking, blind via’s etc.